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1300 271 188 (Press 1 for SYD, 2 for MEL) Mon-Fri 8:30AM-5:00PM

QianLi Bumblebee BGA Reballing Stencil Planting Tin (QS162) for HUAWEI Qualcomm Snapdragon 778G SM7325 CPU Universal Series

QianLi Bumblebee BGA Reballing Stencil Planting Tin (QS162) for HUAWEI Qualcomm Snapdragon 778G SM7325 CPU Universal Series

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 Availability: In stock

Only 3 left

Retail $11.30 +GST
$11.30 +GST

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  SKU: QL-Stencil(QS162)-HUAWEI

ITEM ID: 6971064236930

Stock Sydney: Low Stock (24 Apr 10:22am updated)

Stock Melbourne: Low Stock (24 Apr 10:22am updated)

Warranty: 30-Days Warranty

CRAZY Overnight National Service
(3:30PM SYD/MEL AEST Cut-off time):
Available

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Details

- Square holes round angle BGA stencils.

- Sturdy precise and durable over time.

- Now with a new treatment and with new materials, even easier to use even more precise.

Specifications

Warranty

30-Days Warranty

Reviews

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You're reviewing: QianLi Bumblebee BGA Reballing Stencil Planting Tin (QS162) for HUAWEI Qualcomm Snapdragon 778G SM7325 CPU Universal Series

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